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International expert

J. Krupka is an INTERNATIONAL EXPERT in the area of measurements of electromagnetic properties of materials at microwave frequencies. He has developed several fixtures and the appropriate software intended for precise measurements of electromagnetic properties of dielectrics ferrites, metals, semiconductors, superconductors and metamaterials. Resonators and other products developed and manufactured by J. Krupka (through the Polish spin-off Company QWED) are used in standard research laboratories, international companies and universities. List of users includes the following institutions:

  1. Materials Research Laboratory, Industrial Technology
      Research Institute, Taiwan
  2. DSO National Laboratories, Singapore
  3. General Electric,
  4. 3M Company, St.Paul, USA
  5. 3M Subsidiary, Japan
  6. Intel, USA
  7. Raytheon, Los Angeles, USA
  8. GORE, USA
  9. Lucent Technologies (Bell Labs.), USA
10. Ericsson, Sweden
11. Hughes, Los Angeles, USA
12. University of Limoges, France
13. National Institute of Standards and Technology, Boulder, USA
14. National Physical Laboratory, Teddington, U.K.
15. Texas Center for Superconductivity at University of Houston, USA
16. James Cook University of North Queensland, Townsville, Australia
17. Hereaus, USA
18. Hereaus Subsidiary, Germany
19. ParkNelco, USA
20. National University of Singapore
21. Forschungsgesellschaft fur Informationstechnik, Bad Salzdetfurth,
      Germany
22. Chinese University of Hong Kong
23. Academy of Sciences of the Czech Republic
24. Agence Spatiale Canadienne, Canada
25. Infineon, Germany
26. EPCOS, Austria
27. Agilent Technologies, USA
28. South Bank Universisty, UK
29. Emerson & Cuming, USA
30. RFS Denmark A/S, Denmark
31. CoorsTek Amazing Solutions USA
32. MARSTATE INDUSTRIAL CORPORATION, Taiwan
33. Forschungszentrum Julich GmbH, Germany
34. Xi’an Jiatong University, China
35. Universität des Saarlandes Germany
36. Emerson & Cuming, Belgium
37. ICI Electronics, UK
38. Polyclad Laminates, Taiwan
39. University of Western Australia
40. Regional Research Laboratory, Trivandrum, India
41. Bell Electronics NW. Inc. USA
42. Vega Technology Incorporation, Japan
43. Technische Universitat Ilmenau, Germany
44. Rogers Corporation, USA
45. MOLEX, USA
46. IBM, Canada
47. Alcatel-Lucent, USA
48. L3- Communications, USA
49. National Institute for Materials Science, Japan
50. Daikin-America, USA
51. Rohde-Schwartz, Germany
52. Imagineric Yugengaisha, Japan
53. Huntsman Advanced Materials, USA
54. Fraunhofer Institut Photonische Mikrosysteme, Germany
55. Nelco, Singapore
56. X-Ether, Inc, USA
57. MFG Ratech, Inc, USA
58. University of Hyderabad, India
59. Nestlé Product Technology Centre, Germany
60. Thales Electron Devices Sa, France
61. NelTec, USA
62. Solvay Solexis S.p.A., Italy
63. Sierra Wireless America, Canada
64. Oak-Mitsui Technology, USA
65. TDK R&D Corporation, USA
66. Research In Motion Limited, Canada
67. Loughborough University, UK
68. Borealis AB Polyetenanläggningen, Sweden
69. Institut “Jožef Stefan”, Slovenija
70. Chi Mei Communication Systems, Inc, Taiwan
71. Boeing, USA
72. University of Leeds, England
73. Xian Space Star Technology (Group) Corporation, China
74. Radio Frequency Systems GmbH, Germany
75. Shocking Technologies, Inc., USA
76. MFG Galileo Composites, USA
77. The University of Tennessee, USA
78. LUNG-SHEN TECHNOLOGY CO., LTD., Taiwan
79. National Institute for Interdisciplinary Science & Technology, India
80. UWM University of Wisconsin - Minwaukee, USA
81. Apple Inc., USA
82. University of Oulu, Finland
83. RWTH Aachen, Germany
  84. IAI ISRAEL AEROSPACE INDUSTRIES LTD, Israel
  85. Washington State University, USA
  86. LAB105 Technology, Taiwan
  87. University of Wisconsin-Milwaukee, USA
  88. University of Oulu, Finland
  89. SHAANXI YUJIN IMPORT&EXPORT CO. LTD., China
  90. Dayalbagh Educational Institute (Deemed University), India
  91. Nano-Tech Sp. z o.o., Poland (pomiary, teraz Nano Jacket)
  92. Politechnika ¦l±ska, Poland (pomiary)
  93. Israeli EmbassyTechnical Department, Germany
  94. Foster-Miller, USA
  95. Battelle for US DOE, USA
  96. Research in Motion Limited RIM Six, Canada
  97. Shengyi Company Limited, Hong Kong
  98. LOKMIS UAB, Lithuania
  99. INRS – Energie, Materiaux et Telecommunications, Canada
100. TCS Co., LTD, South Korea
101. Multi-Fineline Electronix Inc, USA
102. AXESS EUROPE S.A.S., France
103. IAI ISRAEL AEROSPACE INDUSTRIES LTD, Izrael
104. SCHLUMBERGER-DOLL RESEARCH, USA
105. CO Nanocenter, Slovenia
106. Université de Sherbrooke, Canada
107. Rohde & Schwartz Regional, Singapore
108. Research in Motion Limited, Canada
109. Griffiths RF Services LLC, USA
110. INFINET Technology Ltd., Taiwan
111. GE (China) Research & Development Center Co., Ltd., China
112. ESUN TRADING CO., LTD, China
113. ATeam Scientific Ltd., Taiwan
114. Tyco Electronics, USA
115. JINAN FURTUNE INTERNATIONAL TRADE COMPANY, China
116. Indian Institute of Technology Madras, India
117. Vikram Sarabhai Space Centre, India
118. HONGKONG FUXIN ELECTRONICS CO., LIMITED, Hong Kong
119. Babcock Communications Limited (T&S), United Kingdom
120. Indian Institute of Technology Guwahati, India
121. NINGBO JIN MAO IMPORT&EXPORT CO., LTD., China
122. CHINA NATIONAL ELECTRONICS COMPONENTS AND EQUIPMENT
        CORP., China
123. University of Oulu, Finland
124. Birla Institute of Technology, India
125. Technische Universität Darmstadt, Germany
126. CHINA XI’AN XIJIN IMPORT AND EXPORT CO.LTD., China
127. SHANGHAI TONGJI SCIENCE, TECHNOLOGY AND MATERIALS CO.,
        LTD., China
128. University of Missouri, USA
129. Guangzhou Kexin Instrument Co., Ltd, China
130. Henan Zhonghui Science and Technology Development Co. Ltd,
        China
131. Zhejiang Zhongda Technical Import co., Ltd., China
132. Corning Incorporated, USA
133. Starkey Laboratories, Inc., USA
134. University of Oklahoma, USA
135. NOKOMIS Inc., USA
136. Isola USA Corp., USA
137. G³ówny Urz±d Miar, Poland
138. ConAgra Foods BSC AP, USA
139. Politechnika Warszawska, Poland
140. Korea Research Institute of Standards and Science, Korea
141. ANHUI IN-SKY GENERAL TRADING Co.,Ltd (U.Hefei), China
142. University of Nottingham, UK
143. SCHOTT AG, Germany
144. FUNDAÇAO DE APOIO AO ENSINO, PESQUISA E EXTENSAO
         DE ITAJUBÁ, Brazil
145. KRONES AG, Germany
146. DOOSAN CORP. ELECTRO_MATERIALS BG, Rep. of Korea
147. Oriental Printed Circuits Ltd., Hong Kong
148. XI’AN Xidian University Mechanical and Electrical Technology Co.,
        Ltd., China
149. Yan Thai (Hong Kong) Co., Ltd., Hong kong
150. ITEQ (WUXI) ELECTRONIC TECHNOLOGIES Co., Ltd, China
151. A2Z Development Center Inc., DBA Lab126, USA
152. UNIPRESS, Poland
153. BAE SYSTEMS Advanced Technology Centre, United Kingdom
154. MICROSOFT CORP., USA
155. Concilium Technologies Pty Ltd., Rep. of South Africa
156. ANHUI CHI-TECH GENERAL TRADING Co.,Ltd, China
157. VISION, Korea
158. Prosperity Dielectrics Co., Ltd., Taiwan
159. IT'IS Foundation, Switzerland
160. Ancentest International Ltd., Hongkong
161. Global Cargo Handling Oy , Finland
162. Instytut Technologii Materia³ów Elektronicznych, Poland